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Jul 4, 2014

Samsung Galaxy F Allegedly Leaks in Live Photo




Following a long series of rumors and leaks on Samsung Galaxy F, said to be a premium smartphone coming from the South Korean mobile phone maker, an alleged live photo with the device is now available online, though it does not show much of the device.

Only a portion of the top of the smartphone is visible in the aforementioned image, confirming that Samsung would plan on releasing it with a metallic body, something that Galaxy S5 too was expected to sport. The leaked photo, available courtesy of GSMArena, also allows us to have a closer look at this metallic case, though the news site claims that the phone will feature only a metallic frame, with the back plate being made out of plastic. The recently leaked press renders with the device have suggested that it would sport a brushed metal finish on the back, and that Samsung would move away from the plastic case available on its Galaxy models, but it seems that things were only partially true. However, no official confirmation on any of these has been provided as of now, and we’ll have to take the info above with a grain of salt for the time being.

In the meantime, we should note that Samsung Galaxy F is rumored to arrive on shelves with a 5.3-inch touchscreen display capable of delivering a Quad HD resolution, which would make it a bit larger than the Galaxy S5. Moreover, the mobile phone is said to hit shelves with a quad-core Snapdragon 805 processor inside, which will be accompanied by 3GB of RAM, so as to provide users with great performance capabilities at all times. Considering the fact that Samsung has already launched a Galaxy S5 LTE-A model in South Korea with this processor inside, as well as with a 2K screen, the hardware specs rumored for the Galaxy F are not far-fetched. However, this also means that the company will need to include some impressive new capabilities inside the upcoming device, so as to justify its positioning above the current flagship.

One of these was said to be the aforementioned all-metallic body, paired with the Snapdragon 805 processor, yet it remains to be seen whether the vendor will make some other changes inside the device as well, such as an upgrade to the rear camera, and more. Samsung Galaxy F is expected to become official sometime in September, perhaps at the IFA 2014 show in Berlin, so it will take a while before we know what it will have to offer.

Alleged Samsung Galaxy F live photo
Image credits to GSMArena

Intel Core M Broadwell Gets Detailed: Core M 5Y70, Core M 5Y10 and Core M5Y10a




Intel’s next-gen Broadwell architecture, which employs 14nm technology, will make a real life debut towards the end of the year.

At Computex 2014, Intel already showed prototypes of super thin and sleek tablets taking advantage of the upcoming Core M series processors based on Broadwell. Compared to their Atom cousins, these new chips are more powerful, but less so when contrasted with the Core i series. Anyway, the upcoming lineup has three distinct versions coming, including the Core M5Y70, Core M 5Y10 and Core M 5Y10a. However, these might not be the final nomenclature, and we might end up seeing the chips arrive on the market sporting names like Core M 70 or something of the sort. The Broadwell “Y” parts arrive with 2 CPU cores and 4MB of L3 cache. The 5Y10 and 5Y10a models will be able to run at 800MHz with the integrated GPU following suit at 100MHz. The microprocessors will take advantage of Turbo Boost, as you can see in this tablet provided by CPU-World. The CPUs bundle VT-d virtualization, which is quite an advanced feat to have onboard. Virtualization solutions allow users to run multiple operating system and application to run in independent partitions all on a single computer.

The 5Y10 and 5Y10A work with DDR3L and LPDDR3 memory and data rates going as far as 1600MHz. Intel rates the microprocessors at 4.5Watt, but the 5Y10 also arrives with a configurable TDP feature, allowing it to run at a lower 4Watt TDP. Last but not least, the 5Y70 has 2 cores and takes advantage of Hyper-Threading technology, which allows the processor to run 4 threads at once. The chip also has Trusted Execution and Vpro. It supports DDR3L/LPDDR3-1600 memory and has 4.5Watt TDP. Its frequency can be raised in Turbo mode to 2.6GHz. It’s pretty cool that these new chips will be able to normally run at a very low frequency, but when the need strikes, the Turbo Boost feat will be able to bestow double the power.

Anyway, now that we know the details of these chips, we’re quite eager to see the first products embedding the architecture arrive into the wild. Intel already teased the Llama Mountain 2-in-1 device, in 12.5-inch and 10-inch flavors but ASUS appears to be the first device maker to have actually taken up this reference design. The Transformer Book Chi T300 is one of the first consumer-ready Core M products, and if we’re lucky, we’re going to be seeing it on retail shelves just in time for the holiday season.

Intel Core M Broadwell first details appear
Image credits to CPU-World

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