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Apr 14, 2014

Huawei Ascend P7 Shows Its Metallic Chassis in Newly Leaked Photos

One of the handsets that Chinese mobile phone maker Huawei has been long rumored to plan on bringing to the market is the Huawei Ascend P7, which emerged in a new set of leaked images today.

Said images, available courtesy of weibo (via gforgames), show that Huawei is likely to adopt a metallic case for the new handset, which should translate into a premium design for the yet unannounced handset. The specifications list of the new device are also said to be high-end, which does not come as a surprise at all, considering the fact that Huawei Ascend P7 is expected to arrive on shelves as the next flagship phone from the Chinese vendor. Previous rumors on the matter suggested that Huawei would pack the device with a 5-inch full HD touchscreen display, and that it also planned on packing it with a 1.6GHz quad-core HiSilicon chipset. Moreover, the handset should land on the market with 2GB of RAM, along with 16GB of internal memory, and a microSD memory card slot for expansion purposes.

One the back, the upcoming smartphone should sport a 13-megapixel camera, complemented by an 8MP front camera for making video calls. A 2460mAh battery is also said to have been included in the device. Huawei Ascend P7 should become official with the Android 4.4 KitKat operating system loaded on top. According to previous reports on the matter, Huawei might unveil the phone in early May, so stay tuned to learn more on the matter.

Huawei Ascend P7
Images credits to weibo via gforgames

iPhone 6 Will Be Made from Aluminum, Leak Indicates

New photos depicting Foxconn molds destined for the iPhone 6 have emerged corroborating a previous leak and potentially confirming Apple’s plans to have a bigger iPhone deployed this year.

According to Steve Hemmerstoffer of Nowhereelse.fr, “Some of the holes that were drilled into the block in fact serve to fix the inserts which will form a crude which is then machined housing (finishes) using a CNC milling machine.” Aided by the comparison iPhone 5s placed next to the mold, the dimensions suggest that the hardware will be used to machine the case of a larger iPhone, seemingly the rumored 4.7-inch model. This is the second leak of its kind. The hardware looks identical, in what would confirm that the former was also legitimate. The leaked photos, however, suggest that Apple will most likely stick with aluminum for the case of its next-generation iPhone. Aluminum has been the company’s top choice for various device enclosures, but this time around people were expecting a more exotic refresh. The Cupertino giant is known to have acquired rights to use a space-age material known as Liquidmetal, which has the properties of steel, glass, and plastic, all with a high strength-to-weight ratio.

It appears that Apple is still not ready to employ the amorphous metal alloy for the manufacturing of entire device casings, as machining or milling are not techniques used to handle this material. Instead, Liquidmetal is heated to the point where it behaves like plastic, and is then stretched, twisted and bent until the desired form is achieved. Lastly, the metal is cooled and left to solidify. The machinery shown in these images would not be suitable for creating Liquidmetal casings. Therefore, if this is a real iPhone manufacturing machine, the next-generation model will most likely be made from aluminum. The iPhone 6 would be Apple’s fourth model made with an aluminum enclosure.

Some rumors have suggested that Apple could put sheets of sapphire crystal on both sides of the phone, something that would also explain the company’s efforts to produce such copious quantities of sapphire at its Mesa, Arizona factory. The leaks also seem to have started early this year. If the Cupertino giant wants to continue with its autumn refresh cycle, then such leaks shouldn’t have occurred for another two months or so. Therefore, we also speculate it might just be possible for Apple to have already entered production with the iPhone 6 for an unveiling at WWDC14 in June.

Purported iPhone machining hardware
Image credits to nowhereelse.fr

LG G3 Leaks in Live Photo, Confirms QHD (2560x1440) Display

LG is expected to launch its next flagship smartphone, the G3, sometime in Q2 2014. According to the latest rumors, the South Korean company may officially introduce the device sometime in May, while the phone will go on sale in June.

Although these timeframes are just speculation for the most part, what’s certain is the fact that LG G3 will come with a stunning display that will support QHD (2560x1440 pixels) resolution. Ubergizmo has just published a picture showing the alleged LG G3 running the AnTuTu benchmark. The cited source claims it has reached out to LG for comments on the G3’s specs and the company has confirmed that its flagship handset will indeed boast a QHD display. Sadly, this is all that LG wanted to comment on the leaked pictures, so there’s no telling what other goodies the G3 will have under the hood.

However, rumors point to a quad-core Qualcomm Snapdragon 801 processor and 32GB of internal memory. No word on the size of the display, but it could be between 5.2 - 5.5 inches. It will be interesting to see whether LG will also add a microSD card and whether or not the G3 will come with at least 3GB of RAM. Stay tuned for more updates on the matter.

Alleged LG G3 picture
Image credits to Ubergizmo

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