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Apr 5, 2012

Lesser Intel Ivy Bridge CPUs Pushed to Q4, “Broken” Ones to Blame




Before there's any chance for people to have a panic attack, let us just say that Intel hasn't delayed the Ivy Bridge CPU line again and that there is nothing “broken” in the architecture itself.   

What we mean by “broken CPUs” is that percentage of chips that don't come out quite right from the assembly lines. 

Not much can be done about the low-end models, but the higher-end ones, with more cores, can be repurposed as lesser ones. 

According to VR-Zone, Intel will be (and probably already is) repurposing lots of CPUs, this being one of the reasons for the Ivy Bridge delay reported in February

In fact, many of the lesser models will be modified higher-end ones. Intel could just throw all the bad ones away, but it would be too expensive to do so. 

There are seven different Ivy Bridge CPU configurations that Intel decided on for the next-generation chip collection. 

The initial launch will include 4+2 (quad-core with GT2 graphics core) and 4+1 models (quad-core with a GT1 graphics core). 

Not all 4+2 chips come out of the production lines in perfect shape, so Intel will “harvest” them for more 4+1 parts. 

In other words, an Intel Core i7-3770 could become a Core i5-3570 by disabling half the GPU execution units and 0.5MB of cache per core. 

What is really complicated is the dual-core CPU creation though. Intel will have 2+2 and 2+1 models, which have their own assembly lines or can be made from “failed” higher-end ones. 

There's a trick to it though: 2+2 chips can only come from 4+2 ones, while 2+1 CPUs can be made from 4+2, 4+1 and even a failed 2+2 if the need arises. 

Intel will still launch Ivy Bridge in June, but many of the lesser models will be available in Q4, or Q3 if things go particularly well. A capital F denotes the “harvested” CPUs (4+1F, 2+1F, etc.).


Apple Commissions New iPad 4G Banners for Australian Resellers




Apple Australia has instructed resellers to update their iPad posters in-store so that customers be well aware of the new iPad’s wireless / cellular capabilities down under. Those who’ve already purchased the cellular version of the tablet computer have been sent an email that clarifies that they’re eligible for a refund.

Apple has told Australian resellers to update their in-store signage with banners that detail the new iPad’s cellular data capabilities in the country, 9to5mac reports. The posters say:

Information about iPad Wi-Fi + 4G model.

This product supports verity fast cellular networks. It is not compatible with current Australian 4G LTE networks and WiMAX networks.

Fast cellular data networks supported include HSPA, HSPA+ and DC-HSDPA.

In addition to requiring resellers to put up these signs, Apple has also taken the matter into its own hands by sending emails to all buyers of an iPad WiFi+4G, clarifying that they’re eligible for a refund, should their purchase have been influenced by the fast cellular capabilities of the device.

Customers must return the tablet unharmed, should they seek a full refund.

Dear iPad owner,

Thank you for purchasing the new iPad with built0in Wi-Fi and support for connecting to fast cellular data networks.

Please note the following information about the Wi-Fi + 4G model:

This product supports very fast cellular networks.

It is not compatible with current Australian 4G LTE networks and WiMAX networks

Fast cellular networks supported include HSPA, HSPA+ and DC-HSDPA.

If you purchased your iPad on or before 28 March 2012 on the basis that it would work with the current Australian 4G LTE networks or WiMAX networks, you may return your undamaged iPad for a full refund before 25 April 2012.

Apple has also updated the iPad marketing on its website, clarifying for Australian online shoppers that Telstra’s airwaves won’t leverage the 4G LTE chips inside the third-generation tablet computer.


Intel Haswell-EX CPUs Will Introduce DDR4 Support




As if the feats Intel has achieved so far weren't enough, people are looking into what the company has planned for the future, like two years from now. 

What VR-Zone most recently uncovered is something that will make the day of people who love high memory speeds. 

Basically, the Haswell-EX family of central processing units, bound for 2014 release, will become the first CPUs to support DDR4 RAM. 

Alas, consumers may find it hard to get one of them, since they are aimed at enterprise applications (they have 16 cores, which will make four-socket motherboards something to behold). 

Meanwhile, the client Haswell processors will stick to a DDR3 memory controller. 

People shouldn't despair though. After all, DDR3 is already capable of great feats. The 3,000 MHz mark was broken on four-module kits just a short time ago after all.


3,000 MHz Broken on Four DDR3 Memory Modules




Some folks at Coolaler got busy this week and tried to see if they could set a new overclocking record. 

Rather than pushing a CPU beyond its limits though, they chose to test the limits of a quad-module memory kit. 

It was G.Skill that provided the RAM (four 4G DDR3-2600 modules), while a Gigabyte Z77X-UD5H motherboard ran an Intel Core i7-3770K “Ivy Bridge” CPU. 

The speed achieved was 3,077 MHz and things get even more interesting when considering that the entire setup was air-cooled. 

This is the second record that G.Skill memory is used for in the past two months. 

Back at the beginning of March, an overclocker managed to drive a dual-channel kit to 3736MHz

We are fairly certain that this is not the last we hear about overclocking feats accomplished on or with Intel Ivy Bridge central processing units.

Purported Leaked Press Invite Shows Galaxy S III Image




As a formal announcement from Samsung is drawing near, more and more rumors regarding its yet unannounced Galaxy S III flagship smartphone emerge. 

The device, initially expected to make an official appearance last month, was pushed back so that the handset vendor could apply final touches to it. 

Apparently, the company is set to make it official on May 22nd during a press event set to take place in  
London, and a leaked invite  to that conference is meant to confirm that. 

On top of that, the said press invitation also offers us a glimpse at what the mobile phone might look like, though it does not show its entire body. 

From the leaked image, we can conclude that Samsung’s new Galaxy S III will be a slim device, boasting a design different from its predecessors, the popular Galaxy S II. 

Moreover, the photo shows that it will feature a sleek metal casing on the outside, and that its lower end will slightly bend towards the back.

There are no keys present on the device’s front in this image, nor is there a microUSB port at the phone’s bottom, as other devices from Samsung usually feature, as GSMArena notes

No specific info on what the forthcoming Samsung Galaxy S III will pack inside was unveiled in the said press invite, but previous rumors on this device did offer some unofficial details on the matter. 

Running under Google’s Android 4.0 Ice Cream Sandwich operating system, the handset will pack a quad-core application processor, complemented by at least 1GB of RAM. 

Moreover, it will feature a large 4.65-inch touchscreen display capable of delivering an HD resolution, while packing an 8MP camera on the back (or a 12MP, according to other rumors).

Overall, the smartphone should top Galaxy S II both in hardware specs and in features and capabilities, but that is something that was expected from a new flagship device.


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