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Apr 14, 2014

Huawei Ascend P7 Shows Its Metallic Chassis in Newly Leaked Photos




One of the handsets that Chinese mobile phone maker Huawei has been long rumored to plan on bringing to the market is the Huawei Ascend P7, which emerged in a new set of leaked images today.

Said images, available courtesy of weibo (via gforgames), show that Huawei is likely to adopt a metallic case for the new handset, which should translate into a premium design for the yet unannounced handset. The specifications list of the new device are also said to be high-end, which does not come as a surprise at all, considering the fact that Huawei Ascend P7 is expected to arrive on shelves as the next flagship phone from the Chinese vendor. Previous rumors on the matter suggested that Huawei would pack the device with a 5-inch full HD touchscreen display, and that it also planned on packing it with a 1.6GHz quad-core HiSilicon chipset. Moreover, the handset should land on the market with 2GB of RAM, along with 16GB of internal memory, and a microSD memory card slot for expansion purposes.

One the back, the upcoming smartphone should sport a 13-megapixel camera, complemented by an 8MP front camera for making video calls. A 2460mAh battery is also said to have been included in the device. Huawei Ascend P7 should become official with the Android 4.4 KitKat operating system loaded on top. According to previous reports on the matter, Huawei might unveil the phone in early May, so stay tuned to learn more on the matter.



Huawei Ascend P7
Images credits to weibo via gforgames

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